QnityTM is a premier technology provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, our high-performance materials and integration expertise make tomorrow’s technologies possible. QnityTM serves the 5G wireless, aerospace and defense, automotive, consumer electronics, datacenter, industrial, medical, and artificial intelligence markets.
LairdTM, now a product brand under QnityTM, is a global leader in materials and solutions for the semiconductor and electronics industries improving electronic devices by creating innovative protection solutions. We solve design issues through products such as EMI shielding and EMI absorbing materials, thermal interface materials, precision and structural metals, and integrated, multi-functional solutions. This latter product family resolves multiple design challenges simultaneously. LairdTM serves automotive, aerospace and defense, medical, computing, data infrastructure, telecom, test and measurement, wearable devices, gaming, and additional markets.
We are a world leader in high-performance thermal interface materials (TIM) and TIM automated application solutions. Our thermal products fill in air gaps and microscopic irregularities, resulting in significantly lower thermal resistance and thus better cooling of increasingly hotter 5G and other components.
A range of technologies to mitigate disruptive waste energy significantly lowers stray electromagnetic interference and reduces negative effects of radiated eneergy.
We enjoy a growing reputation for successfully partnering with companies worldwide to integrate co-engineering practices. Together we produce, to exacting requirements, both modified board-level shielding and modified precision metal parts. Our fast-growing multi-functional solutions team and related product line (called Laird ISE) is helping component manufacturers conquer design issues involving high-speed, high-volume data transfer in increasingly dense packages.